ASMPT

ASMPT

ASMPT is the leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics. With global R&D capabilities, ASMPT drives innovation and delivers precise, automated manufacturing solutions for tomorrow ‘s technologies.

ASMPT Semiconductor Solutions stands for technological excellence and innovation. Its comprehensive portfolio covers the entire process chain – from deposition, laser dicing to high-end mainstream interconnect technologies, as well as next-generation advanced packaging solutions like wafer-level packaging, thermocompression and hybrid bonding. ASMPT creates real value for customers by providing higher performance, more reliable, and more cost-effective semiconductor manufacturing solutions for demanding applications in all key industries.
To learn more about ASMPT, please visit us at www.asmpt.com.

Ball Placement; Attach Systems, Cut & Down Set; Trim; Form Equipment, Dicing; Sawing; Scribing; Separation Equipment, Die Bonding; Attach Equipment, Die Sorter; Pick & Place; Flip Chip Placement Systems, Dispensing Systems, Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners, Molding; Encapsulation; Decapsulation Equipment, Package Handling; Conveying Equipment, Wafer Level Bonders, Wire Bonding Equipment, Wafer Level Bonders, Deposition; Chemical Vapor (CVD); MOCVD; PECVD; ALD/REALD; LPCVD; MVD, Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment, Lithography; Exposure - Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint, Manufacturing Execution Software (MES)