C Sun Mfg Ltd.

C Sun Mfg Ltd.

C SUN was established in 1966, publicly listed on Taiwan Stock Exchange in 2001 (2467.TT). We have built our core business around light and heat technologies, specializing in the integration and research of five key technologies: Thermal Processing, UV Processing, Lamination/Bonding, Film Peeling, and Plasma. We are proud of serving various industries such as PCB, Touch Panel IC substrate, Semiconductor advanced packaging, Shoe Making, Printing, Coating and PV with superior quality of processing equipment. C SUN products have been widely distributed across the globe. As the leading brand of process equipment in Greater China, we are your best partner!

Wafer Level Bonders, Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating, Lamination; Sheet Laminating Equipment, Wafer Level Bonders, Cleaning; Washing; Drying Equipment for Substrate; Fab Processing, Etching; Stripping; Ashing - Dry and Wet Equipment, Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment, Burn-In Accessory Systems, Burn-In Systems, Printed Circuit Board; Wire Board (PCB or PWB) Test and Repair