HEXAGON

HEXAGON is Evatec’s dedicated high‑throughput platform for Fan‑Out Wafer Level Packaging (FOWLP) and WLCSP. It delivers class‑leading RC performance, best‑in‑class throughput and the lowest cost of ownership. Atmospheric degassing, Arctic etch technology and advanced metallization modules ensure outstanding repeatability, highest seed‑layer reliability and extremely long kit lifetimes. The system handles 200 mm and 300 mm wafers with precise, automated front‑end robotics. 

More info: https://www.evatecnet.com