AP-M3500 Series

AP-M3500 Series is a high-flexibility multi-chip SiP die bonder for advanced packaging applications such as photonics, transceivers, SiP, LiDAR, and camera modules. It delivers ±3 µm XY placement accuracy (3σ) with 0.07° theta accuracy (3σ), supports AMHS/Industry 4.0 integration, and features a compact <2 m² footprint.