AP-TC2000 Series

AP-TC2000 Series is a wafer-level thermo-compression bonder for ultra-fine-pitch memory and logic packaging (HBM/xPU). It delivers ±1.5 µm placement accuracy (3σ), supports 12Hi+ stacking, and enables high-throughput HVM in Class 100.

It achieves UPH ≥1500 (single TCB) and ≥3000 (dual TCBs), with fast thermal performance (heating ≥200°C/s, cooling ≥70°C/s). The platform supports both flux and fluxless bonding with plasma oxide removal and N₂ shielding (O₂ <50 ppm), plus EFEM multi-loadport handling, SECS/GEM full traceability, auto calibration, and inspection options.