AGC Asia Pacific

AGC Asia Pacific

AGC will exhibit Glass Carrier used for advanced packaging of Semiconductors, Through Glass Vias, Glass Substrate as well as Film, and Resin products used in semiconductor manufacturing processes and equipment.

PV-Building-Integrated Solutions, PV: Modules, Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners, Wire Bonding Equipment, Modules, Thin Film, Chemical Mechanical Polishing (CMP); Electro Polishing; Mechanical Polishing Equipment, Cleaning; Washing; Drying Equipment for Substrate; Fab Processing, Deposition; Chemical Vapor (CVD); MOCVD; PECVD; ALD/REALD; LPCVD; MVD, Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment, Etching; Stripping; Ashing - Dry and Wet Equipment, Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment, Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive, Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools, Package Substrates; Laminate; Film based, Packages; Ceramic and Other High Temp compounds, Acids; Etchants, Cleaning Chemicals; Solvents; Strippers, Other Specialty Chemicals, Gases Materials, CMP; Grind; Lap; Polish; Abrasive materials, Quartz ware (Silicon Carbide, Fused Quartz Glass, Sapphire), Ceramic & Oxide Ceramic Fixtures, Substrate Materials, Gaskets; Seals; O rings; Elastomers; Resins, Sensors