Name
Hesse Asia Limited
What We Do
Welcome to Hesse Mechatronics at Booth #1356 Founded in 1978, Hesse GmbH is a world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics.
Hesse GmbH designs and manufactures high speed fine pitch/fine wire wedge bonders, heavy wire bonders, smart welding machines and complementary equipment for semiconductor backend assembly.
For detail information, please visit our website: http://www.hesse-mechatronics.com/en/
Smart Welder - Smart Welder SW1085 combines the best technology of ultrasonic welding equipment and wire bonding machines.
Fine Wire Bonder - Bondjet BJ855 is benchmarked for large working area, high bonding speed and ball-wedge, wedge-wedge bonding capability.
Heavy Wire Bonder - Bondjet BJ955/959/985 single-head and BJ931 dual-head are capable of bonding ribbons for applications like power modules, IGBT, automotive devices, etc.
Laser Welder - LW1089 and LW2095 provide large working area, fast welding time, different weld geometries and depths, touch down sensor, precision image recognition (PR) and process monitoring. Allow you to have fully and semi-automatic welding of aluminium and copper lead on DCB substrates, power electronics, battery cell and modules.
More To Come : Detail explanations and demonstrations are available on-site with our professional team standing by to help.
Welcome to visit us at #1356
Hesse GmbH designs and manufactures high speed fine pitch/fine wire wedge bonders, heavy wire bonders, smart welding machines and complementary equipment for semiconductor backend assembly.
For detail information, please visit our website: http://www.hesse-mechatronics.com/en/
Smart Welder - Smart Welder SW1085 combines the best technology of ultrasonic welding equipment and wire bonding machines.
Fine Wire Bonder - Bondjet BJ855 is benchmarked for large working area, high bonding speed and ball-wedge, wedge-wedge bonding capability.
Heavy Wire Bonder - Bondjet BJ955/959/985 single-head and BJ931 dual-head are capable of bonding ribbons for applications like power modules, IGBT, automotive devices, etc.
Laser Welder - LW1089 and LW2095 provide large working area, fast welding time, different weld geometries and depths, touch down sensor, precision image recognition (PR) and process monitoring. Allow you to have fully and semi-automatic welding of aluminium and copper lead on DCB substrates, power electronics, battery cell and modules.
More To Come : Detail explanations and demonstrations are available on-site with our professional team standing by to help.
Welcome to visit us at #1356
Categories (50)
PV: Modules, Device Handling; Feeding Systems, Die Bonding; Attach Equipment, Die Sorter; Pick & Place; Flip Chip Placement Systems, Dispensing Systems, Package Handling; Conveying Equipment, Wire Bonding Equipment, Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating, Welding Equipment, Data Collection; Building control systems, Conveying; Material Handling Systems, Robotics; Transfer Systems
Phone
852-23579400
Address
Unit 807, 8/F, Westin Centre
26 Hung To Road,
Kwun Tong,
Hong Kong
26 Hung To Road,
Kwun Tong,
Hong Kong
Contacts
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