Name
Teledyne Vision Solutions
What We Do
Teledyne Vision Solutions (TVS) provides the industry's most comprehensive portfolio of imaging technology. Our depth and capability are a result of the combined strengths of Teledyne DALSA, e2v CMOS Sensors, FLIR IIS, Lumenera, Photometrics, Princeton Instruments, Judson Technologies, Adimec, and Acton Optics. We deliver a unique blend of innovation, reliability, and service you can trust in the design of your own competitive solutions. We look forward to working with you on your next design.
Count on our relentless commitment to manufacturing excellence to deliver the highest quality components to drive your vision solution. For standard and custom/OEM solutions, designers and users of systems, anyone with advanced sensing requirements or need of specialized vision technology, we offer a wide range of solutions. This includes image sensors, cameras (1D, 2D, smart, SWIR, thermal LWIR, scientific and x-ray), 3D laser sensors and profilers, frame grabbers, and comprehensive software development tools that include AI.
Count on our relentless commitment to manufacturing excellence to deliver the highest quality components to drive your vision solution. For standard and custom/OEM solutions, designers and users of systems, anyone with advanced sensing requirements or need of specialized vision technology, we offer a wide range of solutions. This includes image sensors, cameras (1D, 2D, smart, SWIR, thermal LWIR, scientific and x-ray), 3D laser sensors and profilers, frame grabbers, and comprehensive software development tools that include AI.
Categories (50)
Die Inspection; Die Shear, Fiber Optic Inspection Instruments, Leak Detection Systems - Vacuum or Gas, Microscopes: Optical Microscopes, Microscopes: Scanning Electron Microscope (SEM); Focused Ion Beam (FIB), Transmission Electron Micr, Overlay Measurement, Package Inspection; Lead Scanners, Thermal Sensing; Measurement; Analysis, Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation, Equipment, Nanotechnology, Inspection and Metrology, Integration and Automation, Modules, Wafers, Wafer Identification; Marking Equipment, Linear Test Systems, Printed Circuit Board; Wire Board (PCB or PWB) Test and Repair, Sensors, Factory Automation; Cell Controller Software, Yield Management; Process Control Software, Wafer Bumping Service
Phone
852-3679 3652
Address
Unit 1701-03, Tower 1, Grand Central Plaza,
138 Shatin Rural Committee Road, Shatin, N.T.
Hong Kong, Hong Kong 0000
China
138 Shatin Rural Committee Road, Shatin, N.T.
Hong Kong, Hong Kong 0000
China
Listings
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