Test Research, Inc. (TRI)

Test Research, Inc. (TRI)

Founded in 1989, Test Research, Inc. (TRI) is the World's leading brand in Test and Inspection Solutions in the PCBA Manufacturing Test & Inspection Industry. Test Research, Inc. offers the most robust product portfolio in the industry for automatic test and inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D AXI systems to Manufacturing Defect Analyzers (MDA) and In-Circuit Test (ICT) equipment, TRI provides the most cost-effective solutions to meet a wide range of manufacturing test and inspection requirements. TRI provides Test and Inspection equipment for multiple electronics manufacturing, from Automotive, Medical, and Consumer electronics to Advanced Packaging & Semiconductor manufacturing. TRI's inspection solutions offer Smart Programming, Multiple 3D Technologies, Metrology measurements, and AI-Powered Algorithms. TRI SEMI Inspection Functions Die Bonding Missing, Orientation, Rotation, Shift, Tilted, Chipping, Crack, Scratch, Bond line thickness, Epoxy on Die, Epoxy Coverage, Epoxy Height Wire Bonding Broken, Short, Sweep/Sink, Missing, Sway, Collapse, Loop Height Sagged Wire, Cross Wire Gap, Wire Tracing, Ball Bond Diameter Ball Placement, Stitch Width, Stitch Coverage over Ball Ball-off Pad, Ball touch Pad Distance, Clubbed Ball, Ball Thickness Lifted Ball, Low Landing, Bond on Contamination

Defect; Particle; Bump; Contamination Detection, Review or Inspection, Die Inspection; Die Shear, Package Inspection; Lead Scanners, Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation, Wire Bonding Inspection; Test, X-ray; XRF; 3-D X-Ray; Lexes Systems, Yield Management; Process Control Software